题目

英语翻译
This results in a region of high stress at thesolder balls which are located directly below the die,in particular at thosesolder balls which are located directly below the die edges.
词汇：
under-die pads
the grid of（这里说的是网格还是栅格）
in a grid pattern
原句：the grid of solder balls ofthe BGA package

提问时间：2020-12-13

答案

这导致在DIE正下方的焊球上产生一个高压区域,特别是在DIE边缘下方的焊球上.
under-die pads DIE正下方的pad
the grid of,在这里讲的是网格
in the grid pattern,原句的意思是BGA封装的焊球形成的网格